Bloomberg
Banks Eye $21 Billion of Bonds For Broadcom Chip-Financing Deal
Tuesday, October 27, 2026
Banks plan to sell approximately $21 billion in investment-grade bonds as part of a $63 billion financing package Broadcom assembled to fund chip production for Anthropic. The bond sales are scheduled to begin in early 2026. Broadcom is providing chips to Anthropic, an artificial intelligence developer.
Original reporting:
